Chinese smartphone manufacturer Xiaomi has revealed a new device featuring an ultrasonic fingerprint sensor developed by Qualcomm.
The Xiaomi Mi 5s, which sports an all-metal body and a Qualcomm Snapdragon 821 processor, features the latter’s Snapdragon Sense ID 3D ultrasonic fingerprint sensing technology.
The sensor is featured under-glass, in another innovation.
Qualcomm’s ultrasonic fingerprint sensor is an innovative solution that recognises the user’s fingerprint using ultrasonic waves to scan and create a 3D model of it. The sensor can work through different materials like steel, sapphire, glass, and plastic. The LeEco Le Max Pro (first impressions) was the first smartphone to utilise this technology.
Reviewers say the under-glass nature of the sensor gives the front of the phone a more seamless and cohesive appearance.
The Snapdragon Sense ID platform is integrated with algorithm developed by the Qualcomm Secure MSM foundation, the Qualcomm Biometric Integrated Circuit (QBIC) and custom sensor technology. And it is integrated into the Qualcomm Haven authentication framework, which supports secure biometric authentication for a variety of online and off-line formats, as well
The biometric feature, which an analyst predicted as was reported by Planet Biometrics two weeks ago, is boosted by the inclusion of Precise Biometrics’ mobile fingerprint software product, Precise BioMatch Mobile.