Qualcomm 3D Sonic Max wins CES award
11 January 2021 16:48 GMT

CES awarded Qualcomm Technologies a CES 2021 Innovation Award for the Qualcomm 3D Sonic Max.

Introduced last year, it’s the company's largest (20x30mm2) and most advanced fingerprint sensor based on ultrasonic technology.

The Qualcomm 3D Sonic Sensor enables mobile devices to deliver a high-performance fingerprint security solution that lives beneath a smartphone screen’s surface, tapping single-touch authentication that uses sound waves to recognize and safeguard users. The sensor uses pulse echo sound reflections to create an image of the 3D fingerprint ridges and valleys, and is capable of imaging through wet fingers and contaminants.

At a mere 0.2mm, it’s ultra-thin, too. This enables OEMs to build cutting-edge form factors, such as full glass edge-to-edge displays and flexible OLED displays.

“CES 2021 Innovation Awards Program is an annual competition honoring outstanding design and engineering in consumer technology products,” says CES of the award. “The program recognizes honorees in a multitude of consumer technology product categories and distinguishes the highest rated in each.”

The Qualcomm 3D Sonic Max was recognized with an “Embedded Technologies” category award. It’s 17x bigger than its predecessor, and it enables new advanced security features and experiences including the ability to read two fingerprints simultaneously and to register one’s fingerprint with a single tap.

Mobile devices with Qualcomm 3D Sonic Max are expected to be available later this year. 

Industry Events



connect:ID 5-6 Oct 21